Microsemi today announced a new family of Plastic Large Area Devices (PLAD) that enables avionic systems to meet new safety standards required for today's carbon composite-skinned aircraft. PLAD packaging satisfies the multiple-burst lightning-protection specified by the European Civil Aviation Electronic organization. PLAD technology is available initially for 15kW and 30kW devices. It combines a large die size with an exposed bottom contact for heat sinking that improves power handling as compared to t-h devices, and is compatible with standard assembly automation. Surge screenings are offered to screen weak devices.